Materials for Information Technology : Devices, Interconnects and Packaging (Engineering Materials and Processes)

materials for information technology : devices, interconnects and packaging (engineering materials and processes)

more information about Materials for Information Technology : Devices, Interconnects and Packaging (Engineering Materials and Processes)

Materials for Information Technology : Devices, Interconnects and Packaging (Engineering Materials and Processes)

Editorial Reviews
Book Description
The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are: materials for silicon-based semiconductor devices (including high-k gate dielectric materials); materials for nonvolatile memories; materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and materials for assembly and packaging The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.

About the Author
Dr Ehrenfried Zschech is manager of the Materials Analysis Department at AMD Saxony LLC & Co. KG in Dresden, Germany. Advanced Microdevices (AMD) is a global manufacturer of microprocessors and other integrated circuit-based products. AMD’s manufacturing facility in Dresden is the company’s most advanced and the site also hosts the company’s European R&D centre. Dr Zschech was the coordinator of the IT topic of EUROMAT 2003 in Lausanne. This book, although not a proceedings, has resulted from his work for the conference. It collects contributions on materials for information technology applications from the author’s of conference papers as well as chapters from other authors in order to create a state-of-the art edited volume on the subject from the world’s leading experts in academia and industry. Dr Caroline Whelan is a researcher at the Interuniversity MicroElectronics Center (IMEC) Leuven, Belgium, a leading research institution in microelectronics funded by industry, government, ESA and the EU. Dr Thomas Mikolajick is a researcher at Infineon Technologies AG, a German-based IC products manufacturers. Infineon’s R&D activities cover innovations in nano technologies, photonics, high frequency circuits, mixed signal circuits, electronic biosensors, systems technology, emerging applications.

Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes),Ehrenfried Zschech,Caroline Whelan,Thomas Mikolajick,Springer,1852339411,Electronics - Circuits - General,Engineering - General,Material Science,Metallurgy,Physics,Science/Mathematics,Technology,Technology & Industrial Arts,Assembly,Condensed matter physics (liquids & solids),Electronic materials,Interconnects,Materials Characterisation,Materials science,Packaging,Semiconductors,Technology / Electronics / General,Thin Films

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  4. Morphology of Condensed Matter : Physics and Geometry of Spatially Complex Systems (Lecture Notes in Physics)
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  7. NMR of Polymers
  8. Nonadiabatic Transition: Concepts, Basic Theories and Applications
  9. Nonlinear Dynamics and Computational Physics
  10. Nonlinear Mechanics and Pure Mathematics (Classics of Soviet Mathematics)

Books Info

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