Editorial Reviews
Book Description
This book contains the papers presented at ESREF 2000, the 11th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, which was held in Dresden, Germany, from October 2-6 2000. The papers are being published concurrently as a special issue of the journal
The ESREF symposium is the annual European forum for reliability physics and analysis of electronic components. This Proceedings volume contains oral papers from the nine conference sessions in ESREF 2000. The session topics, reflecting the main areas of interest within the scope of the Symposium, are as follows:
• Design for reliability
• Failure mechanisms in metallizations and dielectrics
• Fault localisation
• Packaging, assemblies and reliability
• Silicon devices
• Product realisation
• Power devices and high temperature electronics
• Compound semiconductors
• Physical failure analysis
The Proceedings contains oral and poster papers from the Symposium, and includes a number of keynote and invited papers. The invited papers feature an international spread of authors and serve to introduce the conference sessions and focus on leading work in these areas. In addition, the Proceedings includes the winner of the Best Paper Award at the Reliability Center Japanese Conference (RCJ 99, Japan).
These Proceedings are available as a CD. The CD-ROM is a hybrid disc allowing PC, Macintosh and UNIX users to share the same directory structure and access common files. All materials are published using Adobe® Acrobat technology. The CD includes versions of Acrobat® Reader 4.0 for Microsoft® Windows™, Apple® Macintosh™ and UNIX®.
Proceedings of the 11th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis,L.J. Balk,W.H. Gerling,E. Wolfgang,Pergamon,0080439144,Electronics - Microelectronics,Physics,Reference,Science/Mathematics,Technology,Technology & Industrial Arts,Technology / Electronics / Microelectronics
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