Advances in Research and Development: Modeling of Film Deposition for Microelectronic Applications, Volume 22 : Modeling of Film Deposition for Microelectronic Applications (Thin Films)
Advances in Research and Development: Modeling of Film Deposition for Microelectronic Applications, Volume 22 : Modeling of Film Deposition for Microelectronic Applications (Thin Films)
Editorial Reviews
Book Description
Physics of Thin Films is one of the longest running continuing series in thin film science, consisting of 22 volumes since 1963. The series contains quality studies of the properties of various thin filmsmaterials and systems.
In order to be able to reflect the development of today's science and to cover all modern aspects of thin films, the series, starting with Volume 20, has moved beyond the basic physics of thin films. It now addresses the most important aspects of both inorganic and organic thin films, in both their theoretical as well as technological aspects. Therefore, in order to reflect the modern technology-oriented problems, the title has been slightly modified from Physics of Thin Films to Thin Films.
Advances in Research and Development: Modeling of Film Deposition for Microelectronic Applications, Volume 22: Modeling of Film Deposition for Microelectronic Applications (Thin Films),Stephen Rossnagel,Abraham Ulman,Academic Press,0125330227,Chemistry - Industrial & Technical,Microelectronics,Optics,Physics,Science,Science/Mathematics,Technology & Industrial Arts,Thin Films Physics,Computer modelling & simulation,Condensed matter physics (liquids & solids),Materials science,Technology / Electronics / General
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