Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science)

Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science)

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Book Description
This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science),M.R. Oliver,Springer,3540431810,Chemistry - Physical & Theoretical,Electronics - Semiconductors,Engineering - Industrial,Grinding and polishing,Material Science,Materials,Physics,Science,Science/Mathematics,Semiconductors,Technology,Technology / Material Science

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